The Evercool new released thermal compound – HTC-03

is composed of Nano Diamond particles. The thermal conductive is up to 12 (W/MC). It is especially suitable for CPU / GPU high heating power module. Non-electrical conductive and viscosity make it easy to spread or remove. The non-curing and non-electrical conductive traits help avoid any short circuiting and provides protection and performance for long-term use.

HTC-03new-released-thermal-compound
The Evercool new released thermal compound – HTC-03 is composed of Nano Diamond particles.

•Nano Diamond particles maintains through a wide range of temperatures, suitable for CPU / GPU high heating power module.

HTC-03-CPU / GPU
The thermal conductive is up to 12 (W/MC). It is especially suitable for CPU / GPU high heating power module.

•Non-electrical conductive and viscosity make it easy to spread or remove

•The non-curing and non-electrical conductive traits help avoid any short circuiting and provides protection and performance for long-term use.

Specifications / Features

  1. Nano Diamond particles maintains through a wide range of temperatures, suitable for CPU / GPU high heating power module.
  2. Non-electrical conductive and viscosity make it easy to spread or remove
  3. Special Nano-diamond material can avoid auto-oxidation or erosion over time.

 

Thermal conductivity : 12 (W/m∘C)
Storage temperature : 15-25(∘C)
Storage Life (under 25∘C) :  3 year
Operating temperature : -50 – 150 (∘C)
Weight : 5g

htc-03package
htc-03package
 QTY :  pcs
 N.W :  kg
 G.W. :  kg
 MEAST :
 CTN Size : cm