HTC-03

EVERCOOL THERMAL PASTE With its Nano Diamond nature thermal conductor and higher thermal conduction efficiency.

 Features
‧Nano Diamond particles maintains through a wide range of temperatures, suitable for CPU / GPU high heating ‧‧power module.
‧Non-electrical conductive and viscosity make it easy to spread or remove
‧Special Nano-diamond material can avoid auto-oxidation or erosion over time.

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Description

 Introduction

•Nano Diamond particles maintains through a wide range of temperatures, suitable for CPU / GPU high heating power module.

•Non-electrical conductive and viscosity make it easy to spread or remove

The non-curing and non-electrical conductive traits help avoid any short circuiting and provides protection and performance for long-term use.

•The non-curing and non-electrical conductive traits help avoid any short circuiting and provides protection and performance for long-term use.

 Features
‧Nano Diamond particles maintains through a wide range of temperatures, suitable for CPU / GPU high heating ‧‧power module.
‧Non-electrical conductive and viscosity make it easy to spread or remove
‧Special Nano-diamond material can avoid auto-oxidation or erosion over time.

 Specifications
Thermal conductivity : 12 (W/m∘C)
Storage temperature : 15-25(∘C)
Storage Life (under 25∘C) : 3 year
Operating temperature : -50 – 150 (∘C)
Weight : 5g

 Packing Detail
QTY : pcs
N.W : kg
G.W. : kg
MEAST : ‘
CTN Size : cm