INTEL LGA1700 / 1851 Low Profile CPU Cooler TDP 73W
EC1700C-810SP
Slim aluminum Extruded CPU Cooler
1U ultra-thin aluminum extruded cooler designed for LGA1700 / 1851, EC1700C-810SP
This CPU cooler is designed with high-density radial aluminum extrusion, with a bottom size of 45 x 45 mm to fully cover the CPU surface, and the bottom contact area is 50% higher than the original cooler.
With EVERCOOL high-performance PWM DC silent fan, the waste heat generated by the CPU can be quickly removed.
The overall height is controlled at ø95 x 25.8mm, which is fully compatible with server cases above 1U (44.45mm).
The locking design uses spring screws with a back plate to ensure installation stability and prevent motherboard deformation.
The maximum heat dissipation wattage of the overall cooler can reach 73W.
Fan bearings can be selected according to your needs, such as two ball bearing, sleeve bearing, and EVEROOL's patented EL bearing, making the perfect match for your system assembly.
Features
- PWM fan adjusts speed according to CPU temperature, good performance and silence.
- Radial aluminum extrusion design increases heat dissipation area.
- The bottom contact area is 50% higher than the original radiator, increasing the heat source contact area.
- For INTEL LGA1700 / 1851 CPU.
- Heat dissipation wattage up to 73W.
- Spring screw with back plate locking design, high stability.
- Suitable for thin Mini-ITX platform and 1U architecture.
Application
- Cloud Server Cabinet
- Edge computing node cooling solution
- High-density virtualization host cluster
- Industrial-grade NAS storage device
- AI computing unit thermal management
Specification
- Dimension: ∅ 95 x 25.8 mm
- Fan Size: 80 x 10 mm
- Voltage: 12V DC
- Current: 0.26 A (Max)
- Power: 3.12 W
- Rotation: 3500 RPM (Max)
- Air Flow: 29.7 CFM (Max)
- Air Pressure: 0.11Inch H2O (Max)
- Noise: < 30.6dBA (Max)
- Connector: 4-pin PWM function
- Bearing Type: Sleeve Bearing
- Lifetime: 25,000 Hours
- Heat Dissipation Wattage: 73W
- Support CPU: INTEL LGA 1700 / 1851
★All specifications can be customized, please contact EVERCOOL
Specifications are subject to change without prior notice
- Gallery
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Spring screws strengthen the fit with the heat source.
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The thin structure is only 25.8mm high and can be installed in a 1U server chassis.
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The bottom contact area is 60% higher than the original radiator, increasing the heat source contact area.
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High-quality DC PWM fan with 4-pin connector, quiet and efficient.
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Equipped with PWM 810 high-efficiency silent fan.
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Backplane bracket that perfectly fits LGA1700 / 1851 sockets.
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INTEL LGA1700 / 1851 Low Profile CPU Cooler TDP 73W | Aluminum Extruded Cooler Manufacturer | EVERCOOL
Based in Taiwan since 1992, EVERCOOL Thermal Co., Ltd. has been a manufacturer of CPU coolers. Its main products include, INTEL LGA1700 / 1851 Low Profile CPU Cooler TDP 73W, CPU cooling system, CPU cooler radiator, extruded aluminum heatsink CPU cooler, low profile CPU cooling cooler fan, SSD cooling fan, HDD cooling fan, hard drive cooler and related peripheral products, which are non-toxic and has passed CE, UL and TUV standards.
EVERCOOL has more than 30 years of experience in R&D and manufacturing of various fans and heat sinks, providing customers with a full range of cooling solutions and professional consulting services. With 30 years of experience in designing and manufacturing DC fans, AC fans, heatsinks, heat pipes, and related peripheral products.
EVERCOOL has been providing customers with high quality CPU coolers since 1992, with both advanced technology and 18 years of experience, EVERCOOL ensures that each customer's requirements are met.