Can a thermal pad be used instead of thermal paste?
It is not recommended to be used instead.
Both the thermal paste and the thermal pad are used to assist in cooling the CPU, so as to maximize the cooling performance of the CPU fan.
However, thermal pads are generally used in some places where it is inconvenient to apply thermal paste, such as the power supply part of the main board, because the power supply component and other parts are not flat, it is inconvenient to apply thermal paste, so you can paste thermal gap pad.
Thermal paste application scenarios
Thermal paste is mainly used for high-performance computing chips, especially central processing units (CPUs) and graphics processing units (GPUs). These components generate a large amount of heat during operation. If the heat cannot be effectively dissipated, it may cause the system to overheat, affect performance, or even damage the hardware. Thermal paste is widely used in personal computers, workstations, gaming consoles and high-performance laptops. Its application enables these devices to operate stably under high loads, maintain optimal performance, and extend hardware life.
How thermal paste works
Thermal paste is a paste substance with high thermal conductivity. Its main function is to fill the tiny gaps between the chip surface and the heat sink. These gaps originate from the unevenness of the two surfaces at the microscopic level. Even if they seem to fit perfectly, there are actually small air gaps that will hinder the transfer of heat from the chip to the heat sink. Thermal paste fills these gaps so that heat can be conducted from the chip to the heat sink more quickly and evenly. It improves the overall heat dissipation efficiency and prevents local overheating, thereby ensuring the stable operation and optimal performance of the equipment.
Thermal pad application scenarios
Thermal pads are mainly used in electronic devices that need to cool multiple heat sources at the same time, such as power supply modules, solid-state drives (SSD), memory modules and notebook computers. In these application scenarios, multiple components need to be cooled simultaneously. The heat is conducted to the cooling module to remove the heat and maintain stable operation.
How Thermal Pads Work
Thermal pad is a soft medium made of high thermal conductivity material. Its unique physical properties enable it to effectively conduct heat. It has good compressibility and elasticity and can deform when pressed, filling the gap between electronic components and heat dissipation modules to maximize the contact area. This compressibility can compensate for height differences between different components and ensure that multiple heat sources are in contact with the cooling module at the same time.
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